Key Features

  • Provides schematics and layouts for the external discrete interface circuitry that needs to be implemented with the Echelon Power Line Smart Transceiver IC.
  • Eight reference designs included.
  • New, smaller PL 3120 / PL 3170 single in-line package (SIP) design included.
  • Available as a download for fast access, providing a quick start for PL design projects.
  • Design Features
  • Manages heat dissipation with optimally designed traces, component selection, and placement.
  • Ensures proper circuit operation with controlled trace capacitances based on the crystal’s oscillation frequency.
  • Provides verified communications performance for receive sensitivity and transmit power.
  • Deals with interference and noise impairments.
  • Provides flexibility with two- and four-layer designs; and one- and two-sided designs.
  • Design Content
  • Layout files for P-CAD®, OrCAD®, PADS®/PowerPCB, Altium, PDF (Adobe), PDIF, ASCII, and Gerber formats for fast and accurate reference design porting.
  • Bill of Materials and schematics in OrCAD& PDF format.
  • Technical details on supported layout tools is available in the PL 3120 / PL 3150 / PL 3170 Power Line Smart Transceiver Data Book

Tech Specs

Specifications
  • 2 layer 1 sided (rectangular format): 0.9 in x 2.5 in (23 mm x 63 mm) 
  • 2 layer 1 sided (square format): 1.3 in x 1.5 in (33 mm x 38 mm) 
  • 4 layer 2 sided (SIP design): 0.7 in x 1.5 in (17 mm x 38 mm) 
  • 4 layer 2 sided: 0.8 in x 1.5 in (20 mm x 38 mm) 
  • 4 layer 2 sided with 2A p-p transmit amplifier: 1.2 in x 2.1 in (31mm x 53mm) 
  • 4 layer 2 sided (SIP design): 0.7 in x 1.1 in (17 mm x 28 mm) 
  • PL 3150 Power Line Smart Transceiver: 
  • 4 layer 2 sided: 1.4 in x 1.9 in (36 mm x 49 mm) 
  • 4 layer 2 sided with 2A p-p transmit amplifier: 1.9 in x 2.6 in (48 mm x 66 mm)

PL DSK Datasheet

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